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TZ-606T特种器件探针测试台
该设备是高科公司精心研发的一款自动探针台,晶圆自动对准、自动定位启测点自动测试等功能。同时具有晶圆ID识别功能,可单芯测试也可连续测试。软件功能丰富可为企业提供不同的测试解决方案,极大提高产能及效应。应用领域涵盖晶圆测试、各类器件、Wafer等进行I-V、C-V、高压器件、光电器件等特性分析测试等。
The equipment is an automatic prober developed by high-tech company. It has the functions of automatic wafer alignment, automatic positioning and automatic test of starting test points. It has the function of wafer ID identification, which can be tested by single core or continuous test. The software has rich functions and can provide enterprises with different test solutions, greatly improving production capacity and efficiency. The application fields include wafer testing, various devices, wafer, etc. to analyze and test the characteristics of I-V, C-V, high voltage devices, photoelectric devices, etc.
主要技术指标 Main Specifications
可测片径 |
4"、5"、6" |
Wafer Size |
4"、5"、6" |
工作台最大行程 | 180mm×240mm | Max. Travel Range | 180mm×240mm |
工作台速度 | ≥200mm/s |
X/Y Axis Speed |
≥200mm/s |
定位精度 |
≤±0.005mm/160mm |
Positioning Accuracy |
≤±0.005mm/160mm |
步进分辨率 | 0.001mm |
Resolution |
0.001mm |
承片台Z向行程 | 10mm |
Chuck Z-axis Travel |
10mm |
Z向定位精度 | ≤±0.003mm |
Z-axis Positioning Accuracy |
≤±0.003mm |
Z向分辨率 | 0.001mm |
Z-axis Resolution |
0.001mm |
θ向调节范围 | ±10° |
θ Rotation Angle |
±10° |
θ向分辨率 | 0.0013° |
θ Resolution |
0.0013° |
晶圆装载方式 |
手动 |
Wafer Loading Mode |
Manual |
外形尺寸(主机) |
700mm×800mm×800mm |
Outline Dimension |
700mm×800mm×800mm |
销售电话 : 18618388462 / 18612902815
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